UBA1706TS
vs
TA31137FNG
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TOSHIBA CORP
|
| Part Package Code |
SSOP
|
SSOP
|
| Package Description |
SSOP, SSOP24,.3
|
LSSOP,
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
| JESD-609 Code |
e4
|
|
| Length |
8.2 mm
|
7.8 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
75 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-30 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
LSSOP
|
| Package Equivalence Code |
SSOP24,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2 mm
|
1.6 mm
|
| Supply Current-Max |
0.0032 mA
|
5.6 mA
|
| Supply Voltage-Nom |
3.3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BIPOLAR
|
| Telecom IC Type |
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
OTHER
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.3 mm
|
5.6 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare UBA1706TS with alternatives
Compare TA31137FNG with alternatives