UES803
vs
SDR6306TX
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
SOLID STATE DEVICES INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
35 Weeks
|
|
| Application |
EFFICIENCY
|
EFFICIENCY
|
| Case Connection |
CATHODE
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.975 V
|
|
| JEDEC-95 Code |
DO-5
|
DO-5
|
| JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
| JESD-609 Code |
e0
|
|
| Non-rep Pk Forward Current-Max |
800 A
|
800 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Operating Temperature-Max |
175 °C
|
|
| Output Current-Max |
70 A
|
70 A
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
150 V
|
150 V
|
| Reverse Current-Max |
25 µA
|
|
| Reverse Recovery Time-Max |
0.05 µs
|
0.05 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
DO-5
|
| Package Description |
|
HERMETIC SEALED PACKAGE-1
|
| Pin Count |
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.80
|
|
|
|
Compare UES803 with alternatives
Compare SDR6306TX with alternatives