UMX5601SM
vs
UM9441E3
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Package Description |
ROHS COMPLIANT, GLASS PACKAGE-2
|
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Samacsys Manufacturer |
Microsemi Corporation
|
|
| Breakdown Voltage-Min |
100 V
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Capacitance-Max |
10 pF
|
10 pF
|
| Diode Capacitance-Nom |
9 pF
|
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Forward Resistance-Max |
0.5 Ω
|
|
| Diode Res Test Current |
100 mA
|
|
| Diode Res Test Frequency |
64 MHz
|
|
| Diode Type |
PIN DIODE
|
PIN DIODE
|
| JESD-30 Code |
O-LELF-R2
|
O-XALF-W2
|
| Minority Carrier Lifetime-Nom |
10 µs
|
2 µs
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
|
| Package Body Material |
GLASS
|
UNSPECIFIED
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Qualification Status |
Not Qualified
|
|
| Reverse Test Voltage |
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
| Terminal Form |
WRAP AROUND
|
WIRE
|
| Terminal Position |
END
|
AXIAL
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
HIGH RELIABILITY, METALLURGICALLY BONDED
|
|
|
|