UPD1002-AI/MQ
vs
FT232RQ-TRAY
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
End Of Life
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
|
| Package Description |
SQFN-32
|
HVQCCN, LCC32,.2SQ,20
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
|
|
| Bus Compatibility |
SMBUS; SPI; VBUS
|
UART, USB
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-XQCC-N32
|
S-XQCC-N32
|
| JESD-609 Code |
e3
|
|
| Length |
5 mm
|
5 mm
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1 mm
|
0.9 mm
|
| Supply Voltage-Max |
5.3 V
|
5.25 V
|
| Supply Voltage-Min |
3.1 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
5 mm
|
5 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
32
|
| ECCN Code |
|
EAR99
|
| Samacsys Manufacturer |
|
FTDI Chip
|
| Clock Frequency-Max |
|
12.02 MHz
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
LCC32,.2SQ,20
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
0.1 mA
|
| Supply Voltage-Nom |
|
5 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare UPD1002-AI/MQ with alternatives
Compare FT232RQ-TRAY with alternatives