UPD23C4001EJGW-XXX
vs
LH534R00ASR
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NEC ELECTRONICS CORP
|
SHARP CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
0.400 INCH, PLASTIC, REVERSE, TSOP2-32
|
| Pin Count |
32
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.71
|
|
| Access Time-Max |
120 ns
|
120 ns
|
| Additional Feature |
USER SELECTABLE 5V
|
|
| JESD-30 Code |
R-PDSO-G32
|
R-PDSO-G32
|
| Memory Density |
8388608 bit
|
4194304 bit
|
| Memory IC Type |
MASK ROM
|
MASK ROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-20 °C
|
|
| Organization |
1MX8
|
512KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSOP2-R
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.95 mm
|
1.2 mm
|
| Supply Current-Max |
0.035 mA
|
0.065 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
MOS
|
CMOS
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
11.3 mm
|
10.2 mm
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Length |
|
21 mm
|
| Output Characteristics |
|
3-STATE
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare UPD23C4001EJGW-XXX with alternatives
Compare LH534R00ASR with alternatives