UPD29F064115F9-EB90X-CD6
vs
KFM1G16Q2M-DEB50
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
SAMSUNG SEMICONDUCTOR INC
|
Package Description |
,
|
VFBGA, BGA63,10X12,32
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
63
|
Access Time-Max |
|
76 ns
|
Additional Feature |
|
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
|
Command User Interface |
|
YES
|
Data Polling |
|
NO
|
JESD-30 Code |
|
R-PBGA-B63
|
JESD-609 Code |
|
e1
|
Length |
|
13 mm
|
Memory Density |
|
1073741824 bit
|
Memory IC Type |
|
FLASH
|
Memory Width |
|
16
|
Moisture Sensitivity Level |
|
2
|
Number of Functions |
|
1
|
Number of Sectors/Size |
|
1K
|
Number of Terminals |
|
63
|
Number of Words |
|
67108864 words
|
Number of Words Code |
|
64000000
|
Operating Mode |
|
ASYNCHRONOUS
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-30 °C
|
Organization |
|
64MX16
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
VFBGA
|
Package Equivalence Code |
|
BGA63,10X12,32
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Page Size |
|
1K words
|
Parallel/Serial |
|
PARALLEL
|
Programming Voltage |
|
1.8 V
|
Qualification Status |
|
Not Qualified
|
Ready/Busy |
|
YES
|
Seated Height-Max |
|
1 mm
|
Sector Size |
|
64K
|
Standby Current-Max |
|
0.00005 A
|
Supply Current-Max |
|
0.04 mA
|
Supply Voltage-Max (Vsup) |
|
1.95 V
|
Supply Voltage-Min (Vsup) |
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
|
1.8 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
OTHER
|
Terminal Finish |
|
TIN SILVER COPPER
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
0.8 mm
|
Terminal Position |
|
BOTTOM
|
Toggle Bit |
|
YES
|
Type |
|
SLC NAND TYPE
|
Width |
|
10 mm
|
|
|
|
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