UPD30550AF2-400-NN1-A
vs
UPD30550F2-300-NN1
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
|
| Part Package Code |
BGA
|
|
| Package Description |
29 X 29 MM, LEAD FREE, CAVITY DOWN, PLASTIC, BGA-272
|
|
| Pin Count |
272
|
|
| Reach Compliance Code |
unknown
|
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
|
| Address Bus Width |
64
|
|
| Bit Size |
64
|
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
133 MHz
|
|
| External Data Bus Width |
64
|
|
| Format |
FLOATING POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
S-PBGA-B272
|
|
| Length |
29 mm
|
|
| Low Power Mode |
YES
|
|
| Number of Terminals |
272
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
BGA
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
GRID ARRAY
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.05 mm
|
|
| Speed |
400 MHz
|
|
| Supply Voltage-Max |
1.7 V
|
|
| Supply Voltage-Min |
1.6 V
|
|
| Surface Mount |
YES
|
|
| Technology |
MOS
|
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
29 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
|
| Base Number Matches |
2
|
|
|
|
|
Compare UPD30550AF2-400-NN1-A with alternatives