UPD350BT-I/Q8XVAA vs VNC2-32L1C feature comparison

UPD350BT-I/Q8XVAA Microchip Technology Inc

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VNC2-32L1C FTDI Chip

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Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD
Package Description QFN-28 LQFP-32
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Bus Compatibility SPI SPI; UART; USB
JESD-30 Code S-PQCC-N28 S-PQFP-G32
Length 4 mm 7 mm
Number of Terminals 28 32
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HQCCN LQFP
Package Equivalence Code LCC28,.16SQ,16
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG FLATPACK, LOW PROFILE
Screening Level AEC-Q100
Seated Height-Max 0.9 mm 1.6 mm
Supply Current-Max 15 mA
Supply Voltage-Max 1.98 V 1.98 V
Supply Voltage-Min 1.62 V 1.62 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.4 mm 0.8 mm
Terminal Position QUAD QUAD
Width 4 mm 7 mm
uPs/uCs/Peripheral ICs Type BUS CONTROLLER, UNIVERSAL SERIAL BUS BUS CONTROLLER, UNIVERSAL SERIAL BUS
Base Number Matches 1 1
Rohs Code Yes
Samacsys Manufacturer FTDI Chip
Address Bus Width
Data Transfer Rate-Max 1.5 MBps
Drive Interface Standard RS232; RS422; RS485
External Data Bus Width
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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