UPD44164364F5-E30-EQ1 vs HM6AEB18202BPL50 feature comparison

UPD44164364F5-E30-EQ1 NEC Electronics Group

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HM6AEB18202BPL50 Renesas Electronics Corporation

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer NEC ELECTRONICS CORP RENESAS ELECTRONICS CORP
Part Package Code BGA BGA
Package Description BGA, 15 X 17 MM, 1 MM PITCH, PLASTIC, FBGA-165
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.27 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0 e0
Length 15 mm 17 mm
Memory Density 18874368 bit 37748736 bit
Memory IC Type DDR SRAM DDR SRAM
Memory Width 36 18
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 524288 words 2097152 words
Number of Words Code 512000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 512KX36 2MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 15 mm
Base Number Matches 1 1
Operating Temperature-Max 70 °C
Operating Temperature-Min
Seated Height-Max 1.46 mm
Temperature Grade COMMERCIAL

Compare UPD44164364F5-E30-EQ1 with alternatives

Compare HM6AEB18202BPL50 with alternatives