UPD44164364F5-E30-EQ1
vs
HM6AEB18202BPL50
feature comparison
Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
0.27 ns
|
0.45 ns
|
Clock Frequency-Max (fCLK) |
333 MHz
|
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-PBGA-B165
|
R-PBGA-B165
|
Memory Density |
18874368 bit
|
37748736 bit
|
Memory IC Type |
STANDARD SRAM
|
DDR SRAM
|
Memory Width |
36
|
18
|
Number of Terminals |
165
|
165
|
Number of Words |
524288 words
|
2097152 words
|
Number of Words Code |
512000
|
2000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Organization |
512KX36
|
2MX18
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
LBGA
|
Package Equivalence Code |
BGA165,11X15,40
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Standby Current-Max |
0.265 A
|
|
Standby Voltage-Min |
1.7 V
|
|
Supply Current-Max |
0.52 mA
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Package Code |
|
BGA
|
Package Description |
|
15 X 17 MM, 1 MM PITCH, PLASTIC, FBGA-165
|
Pin Count |
|
165
|
JESD-609 Code |
|
e0
|
Length |
|
17 mm
|
Number of Functions |
|
1
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Seated Height-Max |
|
1.46 mm
|
Supply Voltage-Max (Vsup) |
|
1.9 V
|
Supply Voltage-Min (Vsup) |
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
|
1.8 V
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
TIN LEAD
|
Width |
|
15 mm
|
|
|
|
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