V58C2512164SDUJ8H vs TC59LM914AMB-50 feature comparison

V58C2512164SDUJ8H ProMOS Technologies Inc

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TC59LM914AMB-50 Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PROMOS TECHNOLOGIES INC TOSHIBA CORP
Part Package Code DSBGA BGA
Package Description TBGA, TBGA,
Pin Count 60 60
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Mode FOUR BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B60 R-PBGA-B60
Length 12 mm 16.5 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type DDR DRAM DDR1 DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 60 60
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C
Organization 32MX16 32MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 2.7 V 2.625 V
Supply Voltage-Min (Vsup) 2.3 V 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS MOS
Temperature Grade INDUSTRIAL OTHER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 10 mm 12.7 mm
Base Number Matches 1 1
Rohs Code No
Access Time-Max 24 ns
JESD-609 Code e0
Terminal Finish TIN LEAD

Compare V58C2512164SDUJ8H with alternatives

Compare TC59LM914AMB-50 with alternatives