VN2460N3-G
vs
TN2640K4-G
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
TO-92, 3 PIN
|
DPAK-3/2
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.29.00.95
|
8541.29.00.95
|
Factory Lead Time |
7 Weeks
|
8 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Additional Feature |
LOW THRESHOLD
|
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
600 V
|
400 V
|
Drain Current-Max (ID) |
0.16 A
|
0.5 A
|
Drain-source On Resistance-Max |
25 Ω
|
5 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
Feedback Cap-Max (Crss) |
25 pF
|
15 pF
|
JEDEC-95 Code |
TO-92
|
TO-252
|
JESD-30 Code |
O-PBCY-T3
|
R-PSSO-G2
|
JESD-609 Code |
e3
|
e3
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
2
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
ROUND
|
RECTANGULAR
|
Package Style |
CYLINDRICAL
|
SMALL OUTLINE
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation Ambient-Max |
1 W
|
|
Power Dissipation-Max (Abs) |
1 W
|
2.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
YES
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Position |
BOTTOM
|
SINGLE
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
6
|
1
|
Case Connection |
|
DRAIN
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Pulsed Drain Current-Max (IDM) |
|
3 A
|
Turn-off Time-Max (toff) |
|
52 ns
|
Turn-on Time-Max (ton) |
|
35 ns
|
|
|
|
Compare VN2460N3-G with alternatives
Compare TN2640K4-G with alternatives