VSC8514XMK
vs
VSC8574XKS-05
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QFN-138
|
BGA-256
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microsemi Corporation
|
Microchip
|
| JESD-30 Code |
S-PBCC-B138
|
S-PBGA-B256
|
| Length |
12 mm
|
17 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
138
|
256
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVBCC
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY
|
| Seated Height-Max |
0.85 mm
|
1.8 mm
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Terminal Form |
BUTT
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
12 mm
|
17 mm
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
5A991.B
|
| Factory Lead Time |
|
9 Weeks
|
| Data Rate |
|
1000000 Mbps
|
| Number of Transceivers |
|
4
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Equivalence Code |
|
BGA256,16X16,40
|
| Supply Current-Max |
|
980 mA
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Pitch |
|
1 mm
|
|
|
|
Compare VSC8514XMK with alternatives
Compare VSC8574XKS-05 with alternatives