W25P16-VSSI
vs
SST26VF016-80-5C-S2AF
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
SILICON STORAGE TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP,
|
SOP,
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
unknown
|
| Clock Frequency-Max (fCLK) |
25 MHz
|
80 MHz
|
| JESD-30 Code |
S-PDSO-G8
|
S-PDSO-G8
|
| JESD-609 Code |
e0
|
e4
|
| Length |
5.283 mm
|
5.275 mm
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
16777216 words
|
16777216 words
|
| Number of Words Code |
16000000
|
16000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
16MX1
|
16MX1
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Programming Voltage |
2.7 V
|
2.7 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.16 mm
|
2.16 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
5.283 mm
|
5.275 mm
|
| Base Number Matches |
4
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.51
|
| Technology |
|
CMOS
|
|
|
|
Compare W25P16-VSSI with alternatives
Compare SST26VF016-80-5C-S2AF with alternatives