W25Q16BVSSIP
vs
M25P16-VMN3TG
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
STMICROELECTRONICS
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOIC-8
|
SOP, SOP8,.25
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Clock Frequency-Max (fCLK) |
80 MHz
|
50 MHz
|
| Data Retention Time-Min |
20
|
20
|
| Endurance |
100000 Write/Erase Cycles
|
10000 Write/Erase Cycles
|
| JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G8
|
| Length |
5.28 mm
|
4.9 mm
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
2097152 words
|
2097152 words
|
| Number of Words Code |
2000000
|
2000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
2MX8
|
2MX8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP8,.3
|
SOP8,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Programming Voltage |
3 V
|
2.7 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.16 mm
|
1.75 mm
|
| Serial Bus Type |
SPI
|
SPI
|
| Standby Current-Max |
0.000005 A
|
0.0001 A
|
| Supply Current-Max |
0.018 mA
|
0.015 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
5.28 mm
|
3.9 mm
|
| Write Protection |
HARDWARE/SOFTWARE
|
HARDWARE/SOFTWARE
|
| Base Number Matches |
1
|
3
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Write Cycle Time-Max (tWC) |
|
15 ms
|
|
|
|
Compare W25Q16BVSSIP with alternatives
Compare M25P16-VMN3TG with alternatives