W25Q32JVSSSQ vs W25Q32JVSSJQ feature comparison

W25Q32JVSSSQ Winbond Electronics Corp

Buy Now Datasheet

W25Q32JVSSJQ Winbond Electronics Corp

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Package Description SOIC-8 SOIC-8
Reach Compliance Code compliant compliant
Clock Frequency-Max (fCLK) 133 MHz 133 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code S-PDSO-G8 S-PDSO-G8
Length 5.23 mm 5.28 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX8 4MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP8,.3
Package Shape SQUARE SQUARE
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Screening Level AEC-Q100
Seated Height-Max 2.16 mm 2.16 mm
Serial Bus Type SPI
Standby Current-Max 0.000015 A
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE
Width 5.23 mm 5.28 mm
Write Protection HARDWARE/SOFTWARE
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8542.32.00.51
Samacsys Manufacturer Winbond
Additional Feature 2.7V NOMINAL AVAILABLE WITH 104MHZ
Alternate Memory Width 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Temperature Grade INDUSTRIAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare W25Q32JVSSSQ with alternatives

Compare W25Q32JVSSJQ with alternatives