W25Q64FVDAIP vs IS25LP064-JBLE1 feature comparison

W25Q64FVDAIP Winbond Electronics Corp

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IS25LP064-JBLE1 Integrated Silicon Solution Inc

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer WINBOND ELECTRONICS CORP INTEGRATED SILICON SOLUTION INC
Package Description DIP, DIP8,.3 SOP,
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 104 MHz 133 MHz
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PDIP-T8 S-PDSO-G8
Length 9.27 mm 5.28 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8MX8 8MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified
Seated Height-Max 5.33 mm 2.16 mm
Serial Bus Type SPI
Standby Current-Max 0.000025 A
Supply Current-Max 0.04 mA 0.14 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 7.62 mm 5.28 mm
Write Protection HARDWARE/SOFTWARE
Base Number Matches 1 1
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30

Compare W25Q64FVDAIP with alternatives

Compare IS25LP064-JBLE1 with alternatives