W25Q80BLUXIP vs M25PE10VMP6TP feature comparison

W25Q80BLUXIP Winbond Electronics Corp

Buy Now Datasheet

M25PE10VMP6TP Micron Technology Inc

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP MICRON TECHNOLOGY INC
Package Description HVSON, HVSON, SOLCC8,.25
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 80 MHz 75 MHz
JESD-30 Code R-PDSO-N8 R-PDSO-N8
Length 3 mm 6 mm
Memory Density 8388608 bit 1048576 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 1048576 words 131072 words
Number of Words Code 1000000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX8 128KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON HVSON
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 2.7 V
Seated Height-Max 0.6 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position DUAL DUAL
Width 2 mm 5 mm
Base Number Matches 1 1
Rohs Code Yes
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
Package Equivalence Code SOLCC8,.25
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Serial Bus Type SPI
Standby Current-Max 0.00001 A
Supply Current-Max 0.015 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE

Compare W25Q80BLUXIP with alternatives

Compare M25PE10VMP6TP with alternatives