W25Q80BLUXIP vs S25FL008A0LNAI003 feature comparison

W25Q80BLUXIP Winbond Electronics Corp

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S25FL008A0LNAI003 Spansion

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP SPANSION INC
Package Description HVSON, VSON, SOLCC8,.25
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 80 MHz 50 MHz
JESD-30 Code R-PDSO-N8 R-PDSO-N8
Length 3 mm 6 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX8 1MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON VSON
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Seated Height-Max 0.6 mm 0.55 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position DUAL DUAL
Width 2 mm 5 mm
Base Number Matches 1 2
Rohs Code No
Part Package Code SON
Pin Count 8
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
JESD-609 Code e0
Moisture Sensitivity Level 3
Package Equivalence Code SOLCC8,.25
Qualification Status Not Qualified
Serial Bus Type SPI
Standby Current-Max 0.00001 A
Supply Current-Max 0.024 mA
Terminal Finish TIN LEAD
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE

Compare W25Q80BLUXIP with alternatives

Compare S25FL008A0LNAI003 with alternatives