W25Q80BLUXIP vs W25Q80BLSNIP feature comparison

W25Q80BLUXIP Winbond Electronics Corp

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W25Q80BLSNIP Winbond Electronics Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Package Description HVSON, SOP, SOP8,.25
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 80 MHz 50 MHz
JESD-30 Code R-PDSO-N8 R-PDSO-G8
Length 3 mm 4.9 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX8 1MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Seated Height-Max 0.6 mm 1.75 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.3 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position DUAL DUAL
Width 2 mm 3.9 mm
Base Number Matches 1 1
Rohs Code Yes
Part Package Code SOIC
Pin Count 8
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
Package Equivalence Code SOP8,.25
Qualification Status Not Qualified
Serial Bus Type SPI
Standby Current-Max 0.000005 A
Supply Current-Max 0.018 mA
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE

Compare W25Q80BLUXIP with alternatives

Compare W25Q80BLSNIP with alternatives