W25Q80BVZPJP vs M25P32-VME6G feature comparison

W25Q80BVZPJP Winbond Electronics Corp

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M25P32-VME6G Micron Technology Inc

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP MICRON TECHNOLOGY INC
Package Description HVSON, HVSON, SOLCC8,.3
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 104 MHz 50 MHz
JESD-30 Code R-PDSO-N8 R-XDSO-N8
Length 6 mm 8 mm
Memory Density 8388608 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 1048576 words 4194304 words
Number of Words Code 1000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX8 4MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON HVSON
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 2.7 V
Screening Level AEC-Q100
Seated Height-Max 0.8 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5 mm 6 mm
Base Number Matches 1 3
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 8
Samacsys Manufacturer Micron
Data Retention Time-Min 20
Endurance 100000 Write/Erase Cycles
Package Equivalence Code SOLCC8,.3
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Serial Bus Type SPI
Standby Current-Max 0.00001 A
Supply Current-Max 0.02 mA
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE
Write Protection HARDWARE/SOFTWARE

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