W25X16-VSSI-G
vs
SST26VF016-80-5C-S2AF
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
SILICON STORAGE TECHNOLOGY INC
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
SOP,
|
SOP,
|
Pin Count |
8
|
8
|
Reach Compliance Code |
unknown
|
unknown
|
Clock Frequency-Max (fCLK) |
33 MHz
|
80 MHz
|
JESD-30 Code |
S-PDSO-G8
|
S-PDSO-G8
|
JESD-609 Code |
e3
|
e4
|
Length |
5.283 mm
|
5.275 mm
|
Memory Density |
16777216 bit
|
16777216 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
1
|
1
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Number of Words |
16777216 words
|
16777216 words
|
Number of Words Code |
16000000
|
16000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
16MX1
|
16MX1
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Programming Voltage |
2.7 V
|
2.7 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.16 mm
|
2.16 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
5.283 mm
|
5.275 mm
|
Base Number Matches |
2
|
1
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.51
|
Technology |
|
CMOS
|
|
|
|
Compare W25X16-VSSI-G with alternatives
Compare SST26VF016-80-5C-S2AF with alternatives