W25X32-VSSI-Z vs W25X32-VSSI-G feature comparison

W25X32-VSSI-Z Winbond Electronics Corp

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W25X32-VSSI-G Winbond Electronics Corp

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description 0.208 INCH, ROHS COMPLIANT, SOIC-8 SOP,
Pin Count 8 8
Reach Compliance Code unknown unknown
Clock Frequency-Max (fCLK) 33 MHz 75 MHz
JESD-30 Code S-PDSO-G8 S-PDSO-G8
JESD-609 Code e3 e3
Length 5.283 mm 5.28 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 1 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 33554432 words 4194304 words
Number of Words Code 32000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32MX1 4MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape SQUARE SQUARE
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260 260
Programming Voltage 2.7 V 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.16 mm 2.16 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 40
Width 5.283 mm 5.28 mm
Base Number Matches 1 1
Additional Feature ORGANIZED AS 16K PAGES OF 256 BYTES
Alternate Memory Width 1
Technology CMOS

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