W26A04B-70LE vs GVT73128A16TS-10L feature comparison

W26A04B-70LE Winbond Electronics Corp

Buy Now Datasheet

GVT73128A16TS-10L Cypress Semiconductor

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description TFBGA, BGA48,6X8,30
Pin Count 48
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 10 ns
I/O Type COMMON COMMON
JESD-30 Code R-PBGA-B48 R-PDSO-G44
JESD-609 Code e1 e0
Length 8 mm
Memory Density 4194304 bit 2097152 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1
Number of Terminals 48 44
Number of Words 262144 words 131072 words
Number of Words Code 256000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -20 °C
Organization 256KX16 128KX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TSOP
Package Equivalence Code BGA48,6X8,30 TSOP44,.46,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Standby Voltage-Min 1 V 2 V
Supply Current-Max 0.025 mA 0.18 mA
Supply Voltage-Max (Vsup) 1.95 V
Supply Voltage-Min (Vsup) 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL GULL WING
Terminal Pitch 0.75 mm 0.8 mm
Terminal Position BOTTOM DUAL
Width 6 mm
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
Standby Current-Max 0.0008 A

Compare W26A04B-70LE with alternatives

Compare GVT73128A16TS-10L with alternatives