W27C512P-45Z vs MX23C2000PC-70 feature comparison

W27C512P-45Z Winbond Electronics Corp

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MX23C2000PC-70 Macronix International Co Ltd

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP MACRONIX INTERNATIONAL CO LTD
Part Package Code QFJ DIP
Package Description 0.330 INCH, LEAD FREE, PLASTIC, LCC-32 DIP, DIP32,.6
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.1.B.2 EAR99
HTS Code 8542.32.00.51 8542.32.00.71
Access Time-Max 45 ns 70 ns
JESD-30 Code R-PQCC-J32 R-PDIP-T32
Length 13.97 mm 41.91 mm
Memory Density 524288 bit 2097152 bit
Memory IC Type EEPROM MASK ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 65536 words 262144 words
Number of Words Code 64000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 64KX8 256KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 245
Programming Voltage 12 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.56 mm 4.9022 mm
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 11.43 mm 15.24 mm
Base Number Matches 1 1
JESD-609 Code e0
Package Equivalence Code DIP32,.6
Standby Current-Max 0.0001 A
Supply Current-Max 0.04 mA
Terminal Finish TIN LEAD

Compare W27C512P-45Z with alternatives

Compare MX23C2000PC-70 with alternatives