W29C011AP15N
vs
S29PL032J55BFI121
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
SPANSION INC
|
| Part Package Code |
QFJ
|
BGA
|
| Package Description |
QCCJ, LDCC32,.5X.6
|
8.15 X 6.15 MM, LEAD FREE, FBGA-48
|
| Pin Count |
32
|
48
|
| Reach Compliance Code |
compliant
|
unknown
|
| Access Time-Max |
150 ns
|
55 ns
|
| Command User Interface |
NO
|
YES
|
| Data Polling |
YES
|
YES
|
| JESD-30 Code |
R-PQCC-J32
|
R-PBGA-B48
|
| JESD-609 Code |
e0
|
e1
|
| Length |
13.97 mm
|
8.15 mm
|
| Memory Density |
1048576 bit
|
33554432 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
48
|
| Number of Words |
131072 words
|
2097152 words
|
| Number of Words Code |
128000
|
2000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
128KX8
|
2MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
VFBGA
|
| Package Equivalence Code |
LDCC32,.5X.6
|
BGA48,6X8,32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Page Size |
128 words
|
8 words
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
225
|
260
|
| Power Supplies |
5 V
|
|
| Programming Voltage |
5 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.56 mm
|
1 mm
|
| Standby Current-Max |
0.0001 A
|
0.000005 A
|
| Supply Current-Max |
0.05 mA
|
0.07 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN SILVER COPPER
|
| Terminal Form |
J BEND
|
BALL
|
| Terminal Pitch |
1.27 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Toggle Bit |
YES
|
YES
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
11.43 mm
|
6.15 mm
|
| Write Cycle Time-Max (tWC) |
10 ms
|
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.51
|
| Additional Feature |
|
TOP AND BOTTOM BOOT BLOCK
|
| Boot Block |
|
BOTTOM/TOP
|
| Common Flash Interface |
|
YES
|
| Moisture Sensitivity Level |
|
3
|
| Number of Sectors/Size |
|
16,62
|
| Ready/Busy |
|
YES
|
| Sector Size |
|
4K,32K
|
|
|
|
Compare W29C011AP15N with alternatives
Compare S29PL032J55BFI121 with alternatives