W3E64M16S-266SBC vs W3E64M16S-266SBM feature comparison

W3E64M16S-266SBC White Electronic Designs Corp

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W3E64M16S-266SBM White Electronic Designs Corp

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer WHITE ELECTRONIC DESIGNS CORP WHITE ELECTRONIC DESIGNS CORP
Package Description BGA, BGA60,9X12,40/32 BGA, BGA60,9X12,40/32
Reach Compliance Code unknown unknown
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 0.75 ns 0.75 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 133 MHz 133 MHz
I/O Type COMMON COMMON
Interleaved Burst Length 2,4,8 2,4,8
JESD-30 Code R-PBGA-B60 R-PBGA-B60
Length 12.5 mm 12.5 mm
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type DDR1 DRAM DDR1 DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 60 60
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 64MX16 64MX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA60,9X12,40/32 BGA60,9X12,40/32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Refresh Cycles 8192 8192
Seated Height-Max 2.56 mm 2.56 mm
Self Refresh YES YES
Sequential Burst Length 2,4,8 2,4,8
Standby Current-Max 0.01 A 0.01 A
Supply Current-Max 0.8 mA 0.8 mA
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 10 mm 10 mm
Base Number Matches 3 3