W3E64M16S-333SBI
vs
W3E64M16S-333SBM
feature comparison
Part Life Cycle Code |
End Of Life
|
Contact Manufacturer
|
Ihs Manufacturer |
MERCURY SYSTEMS INC
|
MERCURY SYSTEMS INC
|
Package Description |
BGA,
|
BGA,
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.32
|
8542.32.00.32
|
Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
Clock Frequency-Max (fCLK) |
333 MHz
|
333 MHz
|
I/O Type |
COMMON
|
COMMON
|
Interleaved Burst Length |
2,4,8
|
2,4,8
|
JESD-30 Code |
R-PBGA-B60
|
R-PBGA-B60
|
Length |
12.5 mm
|
12.5 mm
|
Memory Density |
1073741824 bit
|
1073741824 bit
|
Memory IC Type |
DDR1 DRAM
|
DDR1 DRAM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
60
|
60
|
Number of Words |
67108864 words
|
67108864 words
|
Number of Words Code |
64000000
|
64000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Organization |
64MX16
|
64MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
240
|
240
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.88 mm
|
2.88 mm
|
Self Refresh |
YES
|
YES
|
Sequential Burst Length |
2,4,8
|
2,4,8
|
Supply Voltage-Max (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
10 mm
|
10 mm
|
Base Number Matches |
3
|
3
|
|
|
|
Compare W3E64M16S-333SBI with alternatives
Compare W3E64M16S-333SBM with alternatives