W3J128M72G-1066PBI vs W3J128M72G-800PBIA feature comparison

W3J128M72G-1066PBI Microsemi Corporation

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W3J128M72G-800PBIA Mercury Systems Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP MERCURY SYSTEMS INC
Part Package Code BGA
Package Description 20.50 X 21.50 MM, 1 MM PITCH, PLASTIC, BGA-375 20.50 X 21.50 MM, 1 MM PITCH, PLASTIC, BGA-375
Pin Count 375
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Mode SINGLE BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED
JESD-30 Code R-PBGA-B375 R-PBGA-B375
Length 21.75 mm 21.75 mm
Memory Density 9663676416 bit 9663676416 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 72 72
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 375 375
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128MX72 128MX72
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Seated Height-Max 6 mm 6 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.575 V 1.575 V
Supply Voltage-Min (Vsup) 1.425 V 1.425 V
Supply Voltage-Nom (Vsup) 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 20.75 mm 20.75 mm
Base Number Matches 5 1

Compare W3J128M72G-1066PBI with alternatives

Compare W3J128M72G-800PBIA with alternatives