W949D6DBHX5I vs MT46H32M16LFBF-54AAT:C feature comparison

W949D6DBHX5I Winbond Electronics Corp

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MT46H32M16LFBF-54AAT:C Micron Technology Inc

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Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP MICRON TECHNOLOGY INC
Package Description VFBGA-60 8 X 9 MM, GREEN, PLASTIC, VFBGA-60
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Samacsys Manufacturer Winbond
Access Mode DUAL BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 5 ns 5 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B60 R-PBGA-B60
Length 9 mm 9 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type LPDDR1 DRAM DDR DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 60 60
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32MX16 32MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.025 mm 1 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 8 mm 8 mm
Base Number Matches 1 1
Part Package Code BGA
Pin Count 60
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER

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