WS57C128FB-70D vs WS57C128F-70DM feature comparison

WS57C128FB-70D STMicroelectronics

Buy Now Datasheet

WS57C128F-70DM Waferscale Integration Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS WAFERSCALE INTEGRATION INC
Part Package Code DIP
Package Description 0.600 INCH, CERDIP-28
Pin Count 28
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 70 ns 70 ns
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T28 R-GDIP-T28
JESD-609 Code e0 e0
Length 37.215 mm
Memory Density 131072 bit 131072 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 16KX8 16KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code WDIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.75 V 13.5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.72 mm
Standby Current-Max 0.0005 A 0.0005 A
Supply Current-Max 0.05 mA 0.117 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 3 1

Compare WS57C128FB-70D with alternatives

Compare WS57C128F-70DM with alternatives