WS57C256F-55T vs AM29F002T-120PCB feature comparison

WS57C256F-55T Waferscale Integration Inc

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AM29F002T-120PCB Spansion

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WAFERSCALE INTEGRATION INC SPANSION INC
Package Description 0.300 INCH, CERDIP-28 ,
Reach Compliance Code unknown unknown
Access Time-Max 55 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28 R-PDIP-T32
JESD-609 Code e0
Memory Density 262144 bit
Memory IC Type UVPROM FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 28 32
Number of Words 32768 words
Number of Words Code 32000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL
Programming Voltage 12.5 V 5 V
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.0005 A
Supply Current-Max 0.123 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Part Package Code DIP
Pin Count 32
ECCN Code EAR99
HTS Code 8542.32.00.51
Additional Feature TOP BOOT BLOCK
Boot Block TOP
Type NOR TYPE

Compare WS57C256F-55T with alternatives

Compare AM29F002T-120PCB with alternatives