WS57C919C-25P
vs
PY291A-25WI
feature comparison
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Life Cycle Code |
|
Active
|
Ihs Manufacturer |
|
PYRAMID SEMICONDUCTOR CORP
|
Part Package Code |
|
DIP
|
Package Description |
|
0.300 INCH, CERAMIC, DIP-24
|
Pin Count |
|
24
|
Reach Compliance Code |
|
compliant
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.61
|
Access Time-Max |
|
25 ns
|
JESD-30 Code |
|
R-CDIP-T24
|
JESD-609 Code |
|
e0
|
Memory Density |
|
16384 bit
|
Memory IC Type |
|
UVPROM
|
Memory Width |
|
8
|
Number of Functions |
|
1
|
Number of Terminals |
|
24
|
Number of Words |
|
2048 words
|
Number of Words Code |
|
2000
|
Operating Mode |
|
ASYNCHRONOUS
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
2KX8
|
Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
|
WDIP
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE, WINDOW
|
Parallel/Serial |
|
PARALLEL
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
5.08 mm
|
Supply Current-Max |
|
0.09 mA
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Surface Mount |
|
NO
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
TIN LEAD
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Pitch |
|
2.54 mm
|
Terminal Position |
|
DUAL
|
Width |
|
7.62 mm
|
Base Number Matches |
|
1
|
|
|
|
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