X24C00P-3 vs X24C00PMG-3 feature comparison

X24C00P-3 IC Microsystems Sdn Bhd

Buy Now Datasheet

X24C00PMG-3 IC Microsystems Sdn Bhd

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IC MICROSYSTEMS SDN BHD IC MICROSYSTEMS SDN BHD
Part Package Code DIP DIP
Package Description DIP, DIP8,.3 DIP,
Pin Count 8 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 1 MHz 1 MHz
Data Retention Time-Min 100
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e0
Length 10.03 mm 10.03 mm
Memory Density 128 bit 128 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 16 words 16 words
Number of Words Code 16 16
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 16X8 16X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 240 NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.32 mm 4.32 mm
Serial Bus Type I2C I2C
Standby Current-Max 0.0001 A
Supply Current-Max 0.003 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Write Cycle Time-Max (tWC) 5 ms 5 ms
Base Number Matches 2 1
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare X24C00P-3 with alternatives

Compare X24C00PMG-3 with alternatives