X24C01APIG-3 vs M24C01-WBN3T/G feature comparison

X24C01APIG-3 IC Microsystems Sdn Bhd

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M24C01-WBN3T/G STMicroelectronics

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer IC MICROSYSTEMS SDN BHD STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 8 8
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 0.1 MHz 0.4 MHz
JESD-30 Code R-PDIP-T8 R-PDIP-T8
Length 10.03 mm 9.27 mm
Memory Density 1024 bit 1024 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 128 words 128 words
Number of Words Code 128 128
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128X8 128X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.32 mm 5.33 mm
Serial Bus Type I2C I2C
Supply Voltage-Max (Vsup) 3.63 V 5.5 V
Supply Voltage-Min (Vsup) 2.97 V 2.5 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 7.62 mm 7.62 mm
Write Cycle Time-Max (tWC) 10 ms 10 ms
Base Number Matches 1 1
Pbfree Code Yes
JESD-609 Code e3
Moisture Sensitivity Level NOT APPLICABLE
Terminal Finish MATTE TIN

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Compare M24C01-WBN3T/G with alternatives