X25040SI
vs
X25040SI
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XICOR INC
|
IC MICROSYSTEMS SDN BHD
|
| Package Description |
PLASTIC, SOIC-8
|
SOP, SOP8,.25
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
3 WIRE SERIAL INTERFACE; SPI BUS INTERFACE
|
|
| Clock Frequency-Max (fCLK) |
1 MHz
|
1 MHz
|
| Data Retention Time-Min |
100
|
100
|
| Endurance |
100000 Write/Erase Cycles
|
100000 Write/Erase Cycles
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e0
|
| Length |
4.9 mm
|
4.89 mm
|
| Memory Density |
4096 bit
|
4096 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Number of Words |
512 words
|
512 words
|
| Number of Words Code |
512
|
512
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
512X8
|
512X8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP8,.25
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Serial Bus Type |
SPI
|
SPI
|
| Standby Current-Max |
0.00015 A
|
0.00015 A
|
| Supply Current-Max |
0.003 mA
|
0.003 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
3.9 mm
|
| Write Cycle Time-Max (tWC) |
10 ms
|
10 ms
|
| Write Protection |
HARDWARE/SOFTWARE
|
HARDWARE/SOFTWARE
|
| Base Number Matches |
12
|
6
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.51
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
240
|
|
|
|