X25C02SMT1 vs SLE25C02-S feature comparison

X25C02SMT1 Xicor Inc

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SLE25C02-S Siemens

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XICOR INC SIEMENS A G
Package Description PLASTIC, SOIC-8 SOP,
Reach Compliance Code unknown unknown
Additional Feature 3 WIRE SERIAL INTERFACE; SPI BUS INTERFACE
Clock Frequency-Max (fCLK) 1 MHz 2 MHz
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.9 mm
Memory Density 2048 bit 2048 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Organization 256X8 256X8
Output Characteristics 3-STATE OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Serial Bus Type SPI SPI
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm
Write Cycle Time-Max (tWC) 10 ms 6 ms
Base Number Matches 1 2
ECCN Code EAR99
HTS Code 8542.32.00.51

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