X28C010FMB-12 vs 5962-3826707MZX feature comparison

X28C010FMB-12 Renesas Electronics Corporation

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5962-3826707MZX Xicor Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP XICOR INC
Package Description , CERAMIC, FP-32
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Access Time-Max 120 ns 120 ns
Additional Feature LG_MAX
Data Polling YES
Data Retention Time-Min 100
Endurance 100000 Write/Erase Cycles
JESD-30 Code R-CDFP-F32 R-CDFP-F32
Length 21.08 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX8 128KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DFP DFP
Package Equivalence Code FL32,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Page Size 256 words
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Reverse Pinout NO
Screening Level MIL-STD-883 MIL-STD-883
Seated Height-Max 3.05 mm 3.05 mm
Standby Current-Max 0.0005 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form FLAT FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Toggle Bit YES
Width 10.93 mm 11.6586 mm
Write Cycle Time-Max (tWC) 10 ms
Base Number Matches 3 6
Qualification Status Not Qualified
Temperature Grade MILITARY

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