X76F041HG-3
vs
H1831CH
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
IC MICROSYSTEMS SDN BHD
|
HUGHES AIRCRAFT
|
| Part Package Code |
DIE
|
|
| Package Description |
ROHS COMPLIANT, DIE
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.71
|
| Additional Feature |
PASS SECURE FLASH
|
16-BIT ADDR. MUXED. ON 8 ADDR. LINES
|
| Clock Frequency-Max (fCLK) |
1 MHz
|
|
| JESD-30 Code |
X-XUUC-N
|
X-XUUC-N
|
| Memory Density |
4096 bit
|
262144 bit
|
| Memory IC Type |
FLASH
|
MASK ROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Words |
512 words
|
512 words
|
| Number of Words Code |
512
|
512
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
512X8
|
32KX8
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIE
|
|
| Package Shape |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
| Parallel/Serial |
SERIAL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Programming Voltage |
3 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Type |
NOR TYPE
|
|
| Write Cycle Time-Max (tWC) |
10 ms
|
|
| Base Number Matches |
1
|
1
|
| Access Time-Max |
|
150 ns
|
| Output Characteristics |
|
3-STATE
|
| Supply Current-Max |
|
0.048 mA
|
|
|
|
Compare X76F041HG-3 with alternatives
Compare H1831CH with alternatives