X76F400WIG-2.5
vs
X76F041HG-3
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Contact Manufacturer
|
Contact Manufacturer
|
Ihs Manufacturer |
IC MICROSYSTEMS SDN BHD
|
IC MICROSYSTEMS SDN BHD
|
Part Package Code |
WAFER
|
DIE
|
Package Description |
DIE,
|
ROHS COMPLIANT, DIE
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Additional Feature |
DATA RETENTION = 100 YEARS
|
PASS SECURE FLASH
|
Clock Frequency-Max (fCLK) |
1 MHz
|
1 MHz
|
Data Retention Time-Min |
100
|
|
JESD-30 Code |
X-XUUC-N
|
X-XUUC-N
|
Memory Density |
4096 bit
|
4096 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Words |
512 words
|
512 words
|
Number of Words Code |
512
|
512
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
512X8
|
512X8
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
DIE
|
DIE
|
Package Shape |
UNSPECIFIED
|
UNSPECIFIED
|
Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Programming Voltage |
2.7 V
|
3 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
UPPER
|
UPPER
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Type |
NOR TYPE
|
NOR TYPE
|
Write Cycle Time-Max (tWC) |
10 ms
|
10 ms
|
Base Number Matches |
1
|
1
|
|
|
|
Compare X76F400WIG-2.5 with alternatives
Compare X76F041HG-3 with alternatives