X84640S8G-2.5 vs X84640S8-2.5 feature comparison

X84640S8G-2.5 IC Microsystems Sdn Bhd

Buy Now Datasheet

X84640S8-2.5 IC Microsystems Sdn Bhd

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer IC MICROSYSTEMS SDN BHD IC MICROSYSTEMS SDN BHD
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 8 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 5 MHz
JESD-30 Code R-PDSO-G8 R-PDSO-G8
Length 4.89 mm 4.89 mm
Memory Density 65536 bit 65536 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX8 8KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Serial Bus Type 3-WIRE 3-WIRE
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.5 V 2.5 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm 3.9 mm
Write Cycle Time-Max (tWC) 5 ms 5 ms
Base Number Matches 1 2
JESD-609 Code e0
Moisture Sensitivity Level 3
Terminal Finish TIN LEAD

Compare X84640S8G-2.5 with alternatives

Compare X84640S8-2.5 with alternatives