XAM3359ZCZ50
vs
MIMXRT1052CVL5A
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
LFBGA,
MABGA-196
Pin Count
324
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
26 MHz
External Data Bus Width
Format
FIXED POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B324
S-PBGA-B196
JESD-609 Code
e1
Length
15 mm
10 mm
Low Power Mode
YES
Number of Terminals
324
196
Operating Temperature-Max
90 °C
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Seated Height-Max
1.4 mm
1.52 mm
Speed
500 MHz
Supply Voltage-Max
1.15 V
1.26 V
Supply Voltage-Min
1.06 V
1.15 V
Supply Voltage-Nom
1.1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.65 mm
Terminal Position
BOTTOM
BOTTOM
Width
15 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
SoC
Base Number Matches
1
1
Rohs Code
Yes
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
Additional Feature
24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE
Package Equivalence Code
BGA196,14X14,32
Compare XAM3359ZCZ50 with alternatives
Compare MIMXRT1052CVL5A with alternatives