XAM3359ZCZ50
vs
STA1085HOCTR
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
STMICROELECTRONICS
|
Part Package Code |
BGA
|
|
Package Description |
LFBGA,
|
LFBGA,
|
Pin Count |
324
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
|
|
Bit Size |
32
|
|
Boundary Scan |
YES
|
|
Clock Frequency-Max |
26 MHz
|
|
External Data Bus Width |
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
YES
|
|
JESD-30 Code |
S-PBGA-B324
|
S-PBGA-B361
|
JESD-609 Code |
e1
|
|
Length |
15 mm
|
16 mm
|
Low Power Mode |
YES
|
|
Number of Terminals |
324
|
361
|
Operating Temperature-Max |
90 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Seated Height-Max |
1.4 mm
|
1.7 mm
|
Speed |
500 MHz
|
|
Supply Voltage-Max |
1.15 V
|
1.26 V
|
Supply Voltage-Min |
1.06 V
|
1.14 V
|
Supply Voltage-Nom |
1.1 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
15 mm
|
16 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
Audio SoC
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare XAM3359ZCZ50 with alternatives
Compare STA1085HOCTR with alternatives