XAM3359ZCZ50 vs STA1085HOCTR feature comparison

XAM3359ZCZ50 Texas Instruments

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STA1085HOCTR STMicroelectronics

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer TEXAS INSTRUMENTS INC STMICROELECTRONICS
Part Package Code BGA
Package Description LFBGA, LFBGA,
Pin Count 324
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 26 MHz
External Data Bus Width
Format FIXED POINT
Integrated Cache YES
JESD-30 Code S-PBGA-B324 S-PBGA-B361
JESD-609 Code e1
Length 15 mm 16 mm
Low Power Mode YES
Number of Terminals 324 361
Operating Temperature-Max 90 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Seated Height-Max 1.4 mm 1.7 mm
Speed 500 MHz
Supply Voltage-Max 1.15 V 1.26 V
Supply Voltage-Min 1.06 V 1.14 V
Supply Voltage-Nom 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 16 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC Audio SoC
Base Number Matches 1 1
Rohs Code Yes
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare STA1085HOCTR with alternatives