XC1701L-PCG20C vs MPA17C256FNI feature comparison

XC1701L-PCG20C AMD Xilinx

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MPA17C256FNI Motorola Mobility LLC

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC MOTOROLA INC
Part Package Code QLCC QLCC
Package Description QCCJ, LDCC20,.4SQ QCCJ,
Pin Count 20 20
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Clock Frequency-Max (fCLK) 15 MHz 0.4 MHz
I/O Type COMMON
JESD-30 Code S-PQCC-J20 S-PQCC-J20
JESD-609 Code e3
Length 8.9662 mm 8.9662 mm
Memory Density 1048576 bit 262144 bit
Memory IC Type CONFIGURATION MEMORY EEPROM
Memory Width 1 1
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 1048576 words 262144 words
Number of Words Code 1000000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX1 256KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC20,.4SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 4.57 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.01 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 8.9662 mm 8.9662 mm
Base Number Matches 1 2
Serial Bus Type I2C
Write Cycle Time-Max (tWC) 10 ms

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