XC1701LSOG20C vs XC17V04PCG44I feature comparison

XC1701LSOG20C AMD Xilinx

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XC17V04PCG44I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code SOIC LCC
Package Description SOP, QCCJ,
Pin Count 20 44
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A991.B.1.B.1
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-30 Code R-PDSO-G20 S-PQCC-J44
JESD-609 Code e3 e3
Length 12.827 mm 16.5862 mm
Memory Density 1048576 bit 4194304 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 20 44
Number of Words 1048576 words 4194304 words
Number of Words Code 1000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX1 4MX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP QCCJ
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE CHIP CARRIER
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6416 mm 4.57 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) Matte Tin (Sn)
Terminal Form GULL WING J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 7.5184 mm 16.5862 mm
Base Number Matches 2 1
Pbfree Code Yes

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