XC1701LSOG20C
vs
XQR1704LCC44M
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
SOIC
|
LCC
|
Package Description |
SOP,
|
CC-44
|
Pin Count |
20
|
44
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
3A001.A.2.C
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Additional Feature |
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
|
|
JESD-30 Code |
R-PDSO-G20
|
S-CQCC-J44
|
JESD-609 Code |
e3
|
e0
|
Length |
12.827 mm
|
16.51 mm
|
Memory Density |
1048576 bit
|
4194304 bit
|
Memory IC Type |
CONFIGURATION MEMORY
|
CONFIGURATION MEMORY
|
Memory Width |
1
|
1
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
44
|
Number of Words |
1048576 words
|
4194304 words
|
Number of Words Code |
1000000
|
4000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
1MX1
|
4MX1
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
SOP
|
QCCJ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.6416 mm
|
4.826 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
Terminal Form |
GULL WING
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
7.5184 mm
|
16.51 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
No
|
Screening Level |
|
MIL-PRF-38535
|
|
|
|
Compare XC1701LSOG20C with alternatives
Compare XQR1704LCC44M with alternatives