XC17256ELPC20C vs MPA17C256FNI feature comparison

XC17256ELPC20C AMD Xilinx

Buy Now Datasheet

MPA17C256FNI Motorola Semiconductor Products

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC MOTOROLA INC
Part Package Code QLCC
Package Description PLASTIC, LCC-20 PLASTIC, LCC-20
Pin Count 20
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Factory Lead Time 4 Weeks
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Clock Frequency-Max (fCLK) 15 MHz 0.4 MHz
I/O Type COMMON
JESD-30 Code S-PQCC-J20 S-PQCC-J20
JESD-609 Code e0
Length 8.9662 mm 8.9662 mm
Memory Density 262144 bit 262144 bit
Memory IC Type CONFIGURATION MEMORY EEPROM
Memory Width 1 1
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256KX1 256KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC20,.4SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.572 mm 4.57 mm
Standby Current-Max 0.00005 A
Supply Current-Max 0.005 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 8.9662 mm 8.9662 mm
Base Number Matches 2 2
Serial Bus Type I2C
Write Cycle Time-Max (tWC) 10 ms

Compare XC17256ELPC20C with alternatives

Compare MPA17C256FNI with alternatives