XC17S150APDG8I vs PCB2421P feature comparison

XC17S150APDG8I AMD Xilinx

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PCB2421P Philips Semiconductors

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC PHILIPS SEMICONDUCTORS
Part Package Code DIP
Package Description DIP,
Pin Count 8
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
JESD-30 Code R-PDIP-T8 R-PDIP-T8
JESD-609 Code e3 e0
Length 9.3599 mm
Memory Density 1040096 bit 1024 bit
Memory IC Type CONFIGURATION MEMORY EEPROM
Memory Width 1 8
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 8 8
Number of Words 1040096 words 128 words
Number of Words Code 1040096 128
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1040096X1 128X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 250
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.5974 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.62 mm
Base Number Matches 1 2
Data Retention Time-Min 10
Endurance 10000 Write/Erase Cycles
I2C Control Byte 1010000R
Package Equivalence Code DIP8,.3
Serial Bus Type I2C
Standby Current-Max 0.00003 A
Supply Current-Max 0.001 mA
Write Protection HARDWARE

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