XC17V04PCG44C
vs
XQ1704LPC44N
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
LCC
|
QFN
|
Package Description |
QCCJ,
|
QCCJ,
|
Pin Count |
44
|
44
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.B.1.B.1
|
3A001.A.2.C
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
JESD-30 Code |
S-PQCC-J44
|
S-PQCC-J44
|
JESD-609 Code |
e3
|
e0
|
Length |
16.5862 mm
|
16.5862 mm
|
Memory Density |
4194304 bit
|
4194304 bit
|
Memory IC Type |
CONFIGURATION MEMORY
|
CONFIGURATION MEMORY
|
Memory Width |
1
|
1
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
44
|
44
|
Number of Words |
4194304 words
|
4194304 words
|
Number of Words Code |
4000000
|
4000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
4MX1
|
4MX1
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Peak Reflow Temperature (Cel) |
245
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
16.5862 mm
|
16.5862 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare XC17V04PCG44C with alternatives
Compare XQ1704LPC44N with alternatives