XCF01SVOG20C0100 vs XCF01SVOG20CES feature comparison

XCF01SVOG20C0100 AMD Xilinx

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XCF01SVOG20CES AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Package Description TSSOP, TSSOP,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Additional Feature IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Length 6.5024 mm 6.5024 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type CONFIGURATION MEMORY CONFIGURATION MEMORY
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 20 20
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX1 1MX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Seated Height-Max 1.19 mm 1.19 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 4.4 mm 4.4 mm
Base Number Matches 1 1
Part Package Code TSSOP
Pin Count 20
JESD-609 Code e3
Moisture Sensitivity Level 3
Qualification Status Not Qualified
Terminal Finish Matte Tin (Sn)

Compare XCF01SVOG20C0100 with alternatives

Compare XCF01SVOG20CES with alternatives